On December 3rd, researchers from Intel Corporation and UC Berkeley published a paper in the popular science journal Nature, proposing an idea for a new kind of memory and logic circuit which could be 10 to 100 times more energy-efficient than current microprocessors. The microprocessors we have today are based off complementary metal-oxide-semiconductors (CMOS). These new devices are magneto-electric spin-orbit (MESO) and feature five times more logic operations than their older counterparts.
The MESOs will have the capability to advance current technologies with higher computing power while using less energy. These devices will be used most frequently in machinery like drones and self-driving cars. But, as Sasikanth Manipatruni, who leads hardware development for the MESO project at Intel’s Components Research Group puts it,
“As CMOS develops into its maturity, we will basically have very powerful technology options that see us through. In some ways, this could continue computing improvements for another whole generation of people.”
The researchers go on to describe how they were able to reduce the voltage required for multiferroic magneto-electric switching from 3 volts down to 500 millivolts. This is a reduction to only 1/6th the original voltage, which means a lot less energy is being used.
Multiferroics are materials which exhibit more than one ferric property: ferromagnetism, ferroelectricity, and ferroelasticity. MESO is a multiferroic material because it contains bismuth, iron, and oxygen (BiFeO3), which is a combination of ferromagnetic and ferroelectric states. Researchers believe it is important to take advantage of these two states together by altering the magnetic field because in doing so, you can change the MESO’s entire magnetic state.
Intel and Berkeley’s researchers are working hard to create technology which is not just bigger and better, but that will be innovative enough to propel us into a more sustainable and energy-efficient future. And with the creation of the MESO, they believe they’ve taken the first step to do just that.
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Aircraft maintenance is crucial, especially in the winter when the colder temperatures bring inconveniences and risks to your aircraft. So, it’s good to get head and make sure that your aircraft is ready. Here are some things to consider when preparing your aircraft for the best, and worst, time of the year. It’s crucial to wash, wax, and detail your aircraft. Once the snow comes in, it’ll be difficult to clean off the residual bugs, dirt, and oxidation on your plane. Since snow and ice easily cling onto pre-existing surface contaminants, it’s important to wash and wax because a waxed exterior will shed ice and snow. You should also use aircraft-specific window cleaner and polish to protect and seal aircraft windows.
Don’t forget to change your engine’s oil to remove harmful acids and contaminants. Use a thinner oil and consider anti-corrosive additives to make sure that while you’re flying less, you’re still making sure that your aircraft is in perfect condition for the colder temperatures. Lubrication is also important. Most aircraft owners don’t realize that their aircraft maintenance manuals have a lubrication schedule and chart that details when and how to apply aircraft lubrication. Lubricants like grease and oil are your best bet against excessive wear and corrosion.
After you check the exterior and oil, you need to look at the batteries and check that they’re working at full-capacity. Make sure to replace every battery, not just the aircraft’s main battery. Doing so will increase the safety of flying in extremely cold weather. Another thing you’ll have to check and inspect is the heating system, because most likely your aircraft heating system hasn’t been used in months. You need to ensure that the combustion heater is safe and ready.
And lastly, make sure that you’re stocked with the necessities. Extra batteries, oil, flashlights, water bottles, and the like should be evaluated and replenished as needed. Reload your aircraft with only the necessities. But don’t forget your hot chocolate, and remember, flying in the winter is daunting, but will be lot of fun with just a little extra preparation.
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Transistors have been an integral part of computing for many years and are the foundation of all microchip technology. Transistors have been scaled down in size to nano-levels to where we can fit billions of electronic transistors on a single microchip. However, there’s a limit. So, what’s next? Memristors. Memristors have much more capacity to improve power and performance far beyond what transistors are capable of. They pack more power in a smaller area, have less power needs, and are resistant to radiation.
UK universities have been working on creating memristor design tools. Their research will hopefully make it so memristors can be commercialized. The commercialization of memristors will be reliant on these universities’ research to make prices reasonable and make it so that they work with existing electronic transistors. This is vital because many companies will not replace transistor factories with memristor factories. With the uncertainty of current methods to produce the memristor, the investment to make these factories will be stalled until the research is completed. The target for these goals is 3 years.
The integration of memristors will be the primary catalyst for commercializing them, the importance of electronic microprocessors is still present even with emerging technologies like memristors. Microprocessors seem to be one of the keys to this technology being commercialized. The other key component to its success is ReRAM. This is important because “Resistance Random Access Memory” uses less energy and has reduced latency, drastically improving performance.
Due to the exciting future of microprocessors and its components, including transistors and memristors, demand will increase on both. Many companies will be searching for transistor-based microprocessors once memristors emerge as the new tech.
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Industry heavy-hitters The Boeing Company and Safran SA have recently started combining their capabilities, resulting in new auxiliary power units (APUs); APUs are onboard engines used to start the main engines, as well as power aircraft systems on the ground and in flight. Safran has already been in the business of APU-making, but now with the addition of The Boeing Co, they are sure to demand more of the market share from rivals Honeywell and UTC –the two leading manufacturers of this part.
Not only will this 50/50 venture benefit Safran Group, but it will also put Boeing in a better position as they strive to branch into more profitable services. As Boeing CFO Greg Smith put it,
“This move will strengthen Boeing’s vertical capabilities as we continue to expand our services portfolio and make strategic investments that accelerate our growth plans”
Boeing recently acquired aerospace parts company, KLX Inc, furthering their expansion into the aircraft services market.
Stan Deal, President and CEO of Boeing Global Services commented that
“This strategic partnership will leverage Boeing's deep customer and airplane knowledge along with Safran's experience in designing and producing complex propulsion assemblies to deliver expanded, innovative services solutions to our customers."
Currently, Boeing and Airbus SE are in competition to widen margins of third-party suppliers that typically dominate the repairs and services market.
Safran has also held a partnership with General Electric Co, allowing them both to make the LEAP-1B engines that go on Boeing’s 737 MAX. Prior to this partnership’s fruition, Safran had been supplying Boeing with an extensive range of components for their commercial and defense programs; this made it evident a partnership would bode well for both involved parties.
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As IT hardware devices become more powerful, the need for cooling systems through IC motor parts are becoming more important. Refusing to upgrade electronic components such as cooling parts, hardware systems is at risk of overheating, causing damage. With heavy application use, making sure IC motor parts, Toshiba electrical parts, and electronic parts from Toshiba should be up to date, ensuring proper usage and longevity of hardware systems.
Toshiba Electronics has recently made improvements to fan motor IC. Toshiba is a leading electronics company that specializes in electrical parts and electronic components. The fan motor is a key electrical component to hardware systems in many different applications. The newly designed fan motor offers a more robust fan that can spin faster, increasing its RPM (revolutions per minute). As the motor provides a higher and much smoother output, the fans of the motor is able to turn much faster-the fan is now able to deliver a much more powerful cooling effect when installed.
Not only does Toshiba electrical parts, it offers state of the are IC motor parts, that has been tested and proven through intensive research and development. Toshiba has years of experience in the computer industry and many large organizations purchase electronic components from Toshiba. Coming up with a more powerful IC motor parts is just an example of what Toshiba can provide to applications and hardware devices. This new electronic component can run longer and faster with using less power. The simply designed new motor part is designed for maximum efficiency.
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In early April of this year, Intel Corporation released their newest core processors, the 8th Generation. The main target audience for this new, and more powerful core, is hardcore PC users. These would be customers who use their computers day in and day out, for business or pleasure, and need a solid core processor to get them through the day.
These new 8th Generation processors come built with an innovated Intel Octane memory and the ability to handle multiple platforms. There was also a new option, released around the same time, titled Data Drive Acceleration and combined the two can load videos, pictures and video games and an increased speed.
These new releases help to bulk up Intel’s current line and make sure that all the needs of their customers can be met. The newest processors, whether i5, i7 or i9, allow video streaming in high definition to be quicker and for video editing to be smoother. The 8th Generation Core processor comes with a WiFi speed that is, on average, 2 times quicker than most.
The business 8th Generation Core options are extremely fast and are about to support immersive 3d graphics and applications. This option will be built into business focused laptops from multiple companies.
This newest addition to Intel’s lineup really shows how versatile this company is. They know how to create a product that their customers can rely on and look forward to using each and every day. Keep on the lookout for even more updates from Intel in regards to their newest core processor.
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Analog Devices and Microsemi Corporation have recently collaborated and introduced the first ever high-power evaluation board for the half-bridge SiC power modules. These evaluation boards will go up to 1200 V and 50 A at a two hundred kHz switching frequency. This new isolated board has been produced to upgrade design reliability and lowering the need for the production of additional prototypes. This will maximize time, lower costs, and reduce the time needed to market towards power conversion and energy storage customers.
The upgraded isolated board can be used as the building block for topologies that are more complex. This includes full bridge or multi-level converters. The new board can also serve as a final evaluation form or as a “in converter-like” configuration to be used for full tests and evaluations of Analog Devices’. These Analog Devices’ include the ADuM4135, which is an isolated gate driver that uses iCoupler digital isolation technology and the LT3999 DC-DC driver using a high-powered system.
The new, high-powered evaluation board allows for the SiC power modules made by Microsemi to supply benefits like a common bench test, heightened power density to reduce size and cost. This also provides an isolated substrate that is a conductive substrate and a minimum parasitic capacity that allows for greater efficiency, better performance, and good thermal management. These characteristics allow for the board to be compatible for applications that include charging for electrical vehicles, hybrids, DC-DC converters, power supplies with switched modes, aviation actuation systems, motor control that is high-powered, MRIs and X-Rays, plasma and semi cap equipment, and lasers and welding.
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Panasonic Corporation, a well-known electronics corporation, recently began the mass production of prismatic-type automotive lithium-ion batteries at their factory in Dalian, China. The ceremony that celebrated the first batch of shipment took place this March.
The market for eco-friendly vehicles which covers hybrids and electric cars, is expanding every year due to the increase of environmental awareness these past few years. In order to respond to the demand for eco-friendly vehicles, Panasonic has begun the process of producing prismatic-type automotive lithium-ion batters at the factory in China, the first production site of its kind.
Due to the foreseen expectations and high demand for automotive lithium-ion batteries, Panasonic Corporation produces the batteries in the Dalian factory, then sends them to the markets in China and North America. In the near future, shipments will enlarge to reach further destinations which will help push the drive for eco-friendly and conscious vehicles.
The beginning stages of the mass production shipments of these lithium-ion batteries intended for automobiles has recently begun in this factory, and now, Panasonic has now created a production system that expands to Japan, the United States, and China, all three of which are important global locations. By fueling the global competitiveness of these automotive batteries through these global sites, Panasonic will continue to expand their automotive battery market in the future.
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A new innovative methyl acrylate-based adhesive has been introduced into the market. Panacol a worldwide international manufacture has released the Penloc GTN a potent adhesive that is designed to work well with aluminum, brass, ceramics, steel, along with many other building supplements.
This innovative adhesive product has many unique traits that can differentiate it from other existing products. This adhesive is easily maneuverable upon application and is able to be completed in a short span of only 10-15 minutes (time may vary). Able to with stand harsh conditions along with extreme temperatures with its implemented thermal stability.
Despite its extensive list of traits that it provides to the adhesive industry one of its most prolific trait is its low odor characteristic. The adhesive has a drying technology that clearly signifies its completion with its change of color. Upon applying, it will show a clear color and slowly turn into a grayish color.
The adhesive is packaged and distributed in a 50ml double cartridge through its approved supplier. It can also be applied through an applying component used for large scale jobs.
Panacol is a world renown manufacture that has been providing the industry with UV adhesives, structural adhesives and conductive adhesives. Providing to an extensive list of customers including industrial customers to customers requiring medical grade adhesives.
The unit used to apply the adhesives resembles a hand-held gun that holds the double cartridges blending both tubes together creating the potent component.
There has been a wide variation of Penloc adhesives that have been released for different type of jobs. Varying from temperature resistant to large size in application bottles. Euroband also offers translucent adhesive to the market amongst many other released types.
Euroband states that it will with hold the toughest jobs that it is given.
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Samsung, the global leader in technology for advanced memory, recently announced its production of the technology industries first 16 gigabit graphics double data rate memory. This giant memory card will mainly be used for advanced graphics processing for gaming devices and graphics cards. These memory cards will also be useful for artificial intelligence systems, networks and the automotive industry. The memory card will be produced using Samsung’s advanced 10-nanomter class process technology.
The card will come with 16Gb density, which will double Samsung’s current 20 nanometer GDDR5 memory. The new card is expected to preform at 18 gigabits per a second in speed and will have a transfer rate of 72 gigabits per a second. The 16 gigabit GDDR6 memory is considered energy saving, it operates at 1.35V a 35 percent decrease from the last generation of cards. These features give the memory card a twofold advantage over Samsung’s previous card.
The production of this new chip is time sensitive because it will play a critical role in the early launches of next-generation graphics cards and systems. This product will be of high demand as soon as It is released to the public. Fields such as 8K ultra HD video processing, artificial intelligence, augmented and virtual reality will highly depend on the functionally, speed, and storage space of this memory card to keep up with the country’s futuristic demands. This product will allow Samsung to dramatically expand their market value and the market value of memory cards in general over the next few years. Samsung believes that dreams are boundless, and they will keep pushing to release the best products for their customers.
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